Review of the Global Trend of Interconnect Reliability for Integrated Circuit

Authors: Qian Lin, Haifeng Wu, Guoqing Jia

ABSTRACT
Interconnect reliability has been regarded as a discipline that must be seriously taken into account from the early design phase of integrated circuit (IC). In order to study the status and trend of the interconnect reliability, a comprehensive review of the published literatures is carried out. This can depict the global trend of ICs’ interconnect reliability and help the new entrants to understand the present situation of this area.

Source:

Journal: Circuits and Systems
DOI: 10.4236/cs.2018.92002 (PDF)
Paper Id: 82335 (metadata)

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